This paper proposes a partial state-feedback reduced-order switching predictive model to support next-generation optical lithography technology roadmaps. The approach addresses the trade-off between increasing measurement quantities to improve overlay accuracy and the associated challenges, including elevated measurement noise, reduced throughput, and overlay/placement errors under uncertain operating conditions. By minimizing chip placement errors and reducing unnecessary measurements, the method enhances system performance and throughput. The solution employs a streamlined model with adaptive switching logic to manage time-varying uncertainties caused by fluctuating operating conditions. The approach is implemented on state-of-the-art lithography scanners to mitigate the spatiotemporal dynamics of reticle heating, serving as a representative industrial application. Reticle heating deteriorates with increased throughput, introducing spatiotemporal distortions that directly reduce chip placement accuracy. Experimental results demonstrate significant improvements: placement error reduction of 2-3 times and throughput improvement of 0.3 seconds per wafer.
This paper aims to bridge the gap between theoretical control concepts and practical implementation in lithography systems, proposing a partial state-feedback, reduced-order switching predictive control method while maintaining throughput and overlay performance.
Inputs:
Outputs:
Constraints:
The system's state-space formulation is expressed as:
\dot{x}_i = A_i x_i + B_i u_e + B_f u_f \\ u_f = \Gamma(.)y \\ u_i = C_i x_i \end{cases}$$ Where: - $x_i$: internal deformation state - $u_e$: external heating profile - $u_f$: feedback signal from alignment sensors - $\Gamma(.)$: function converting sparse feedback measurements to appropriately dense layout - $C_i$: output mapping from $x_i$ to $u_i$ #### Four-Step Design Methodology **Step 1 - Scheduler Integration and Closed-Loop Feedback**: The scheduler $\Phi$ is defined as: $$\Phi = \{M_i | I \in R_i, \forall i \in \mathbb{Z}\}$$ Where $I \in \{y, u_e, u_\Delta\}$ represents the historical information set. **Step 2 - Nominal Reduced-Order Model**: Employs Krylov moment-matching method for parameterized model reduction: $$M_i := \begin{cases} \dot{x}_i = A_i x_i + B_i u_e \\ u_i = C_i x_i \end{cases}$$ **Step 3 - Partial Feedback Integration**: Integrates partial state feedback into the reduced-order model by explicitly introducing the feedback input channel $B_f$. **Step 4 - Uncertainty Handling**: Uses a centralized approach to represent the model as: $$\hat{P}(\Phi|I) = M_n + M_\Delta = M_n + \Delta_m(\Phi|I)$$ ### Technical Innovations 1. **History-Driven Switching Strategy**: Unlike variable-gain control based solely on feedback signal magnitude, this method uses historical data $I$ to guide model selection. 2. **Preservation of Physical Interpretability**: Maintains the original physical interpretation of the reduced-order model through the Krylov moment-matching method. 3. **Lur'e-Type System Framework**: Transforms the system into a Lur'e-type system, combining linear dynamic components with nonlinear/uncertain components. ## Experimental Setup ### Experimental Platform - **Equipment**: ASML Twinscan state-of-the-art lithography scanner - **Application Scenario**: Reticle heating mitigation - **Test Conditions**: 2 batches, 16 wafers per batch ### Evaluation Metrics 1. **Placement Error**: Overlay placement error in x-y directions 2. **Throughput Improvement**: Time savings per wafer 3. **Stability**: Performance consistency under different operating conditions ### Comparison Methods 1. **Traditional Method**: Current standard sensor-based method 2. **Linear Method**: Linear version using only the nominal model $M_n$ ### Implementation Details - Uses 3 moments to describe nominal and uncertain reticle heating models - Skips edge alignment marks, using only top-bottom alignment marks - Saves approximately 0.3 seconds per wafer per measurement ## Experimental Results ### Main Results 1. **Placement Error Improvement**: - 2-3 times reduction in x-y direction placement error compared to traditional methods - 2 times performance improvement in x-y direction for the first 2 wafers - Maintains stable and improved accuracy under both nominal and uncertain conditions 2. **Throughput Improvement**: - Saves 0.3 seconds per wafer - Can increase throughput by up to 7 wafers per hour 3. **Robustness Verification**: - Linear method shows 3 times performance degradation under uncertain conditions - Proposed method maintains consistent performance across different image regions ### Verification Across Different Image Regions In experiments with smaller exposure areas: - Proposed method achieves 3 times performance improvement under both nominal and uncertain conditions - Linear method shows 2-3 times performance degradation - Validates the robustness and adaptability of the method ### Stability Analysis Global uniformly ultimately bounded asymptotic stability (GUAS) is proven through the small-gain theorem, satisfying: - Reticle heating physics ensures bounded dynamics - Both nominal and uncertain models satisfy stability conditions - Equilibrium point $x^*$ (where $\|z\| = 0$) is GUAS ## Related Work ### Lithography System Control - Traditional linear predictive control methods are limited by the "waterbed effect" - Nonlinear approaches include variable-gain control, filtering, and switching controllers - Existing methods often neglect spatiotemporal dynamics ### Model Reduction Techniques - Balanced truncation, Krylov subspace methods, proper orthogonal decomposition (POD) - Existing methods reduce dimensionality but lose physical interpretability - This paper's method maintains physical interpretation while achieving computational efficiency ### Switching System Control - History-based switching strategies - Event-driven control methods - Lur'e system stability theory ## Conclusions and Discussion ### Main Conclusions 1. Successfully developed partial state-feedback reduced-order switching predictive models 2. Achieved simultaneous improvement in accuracy and throughput 3. Verified robustness under uncertain operating conditions 4. Provided theoretical stability guarantees ### Limitations 1. Method applicability depends on specific physical system characteristics 2. Switching logic design requires domain expertise 3. Model reduction may affect accuracy under certain extreme conditions ### Future Directions 1. **Unified Predictive Framework**: Extend to spatial and temporal variations across the entire system 2. **Intelligent Measurement Optimization**: Integrate prediction, learning, and intelligence to reduce unnecessary measurements 3. **Practical Assumption Validation**: Narrow the gap between theoretical concepts and practical applications ## In-Depth Evaluation ### Strengths 1. **Strong Industrial Relevance**: Directly addresses practical problems in semiconductor manufacturing 2. **Solid Theoretical Foundation**: Provides rigorous stability analysis 3. **Comprehensive Experimental Validation**: Verified on real industrial systems 4. **Methodological Innovation**: Novel approach combining reduced-order modeling, switching control, and partial feedback 5. **High Practical Value**: Simultaneously improves accuracy and throughput with direct economic value ### Weaknesses 1. **Limited Applicability Scope**: Primarily addresses reticle heating issues; generalization to other applications requires verification 2. **Complexity Management**: Design and tuning of switching logic may require substantial expertise 3. **Limited Comparative Experiments**: Lacks in-depth comparison with other advanced control methods 4. **Long-Term Stability**: Insufficient discussion of performance degradation during extended operation ### Impact 1. **Academic Value**: Provides new theoretical framework for spatiotemporal system control 2. **Industrial Value**: Direct application to multi-billion-dollar semiconductor equipment 3. **Technology Dissemination**: Method extensible to other precision manufacturing systems 4. **Reproducibility**: Provides clear implementation steps and theoretical foundation ### Applicable Scenarios 1. **Precision Manufacturing Systems**: Manufacturing processes requiring sub-nanometer precision 2. **Thermal Management Applications**: Systems involving thermal deformation control 3. **High-Throughput Requirements**: Scenarios requiring efficiency improvement while maintaining precision 4. **Uncertain Environments**: Industrial systems with frequently changing operating conditions ## References The paper cites 45 relevant references covering multiple fields including control theory, lithography technology, model reduction, and system identification, providing a solid theoretical foundation and technical background for the research. --- **Overall Assessment**: This is a high-quality engineering application paper that successfully applies advanced control theory to practical industrial problems, achieving a good balance between theoretical rigor and practical value. The contribution lies not only in technical innovation but also in providing practical solutions for the critical semiconductor manufacturing industry.